Iei-integration ICE-DB-T6 Bedienungsanleitung

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Type 6 Carrier Board Design Guide
Page I
User Manual
COM Express Type 6 Module
Carrier Board Design Guide
s Carrier Board Design Guide
Rev. 1.01 – 1 August, 2013
Seitenansicht 0
1 2 3 4 5 6 ... 128 129

Inhaltsverzeichnis

Seite 1 - Carrier Board Design Guide

Type 6 Carrier Board Design Guide Page IUser Manual COM Express Type 6 Module Carrier Board Design Guide ’s Carrier Board Design Guide Rev. 1.01 –

Seite 2 - Revision

Type 6 Carrier Board Design GuidePage X List of Tables Table 1-1: ICE-QM770 Specifications ...

Seite 3 - Copyright

Type 6 Carrier Board Design GuidePage 90 Step 3: Locate the BIOS file that needs to be updated. Figure B-3: Locate BIOS File Step 4: Check ”Pro

Seite 4 - Table of Contents

Type 6 Carrier Board Design Guide Page 91 Figure B-5: AFUWIN – Flash Step 6: Restart the system and check the BIOS menu. The BIOS version is cha

Seite 5

Type 6 Carrier Board Design GuidePage 92 B.2.2 Using DOS Command To update BIOS in the DOS environment, prepare a USB flash drive that contains boot

Seite 6

Type 6 Carrier Board Design Guide Page 93 Step 2: Input command GO and press Enter. The system starts updating BIOS. Figure B-9: GO Command Step

Seite 7

Type 6 Carrier Board Design GuidePage 94 Step 4: Restart the system and check the BIOS menu. The BIOS version has been changed to MR11. Figure B-1

Seite 8 - List of Figures

Type 6 Carrier Board Design Guide Page 95Appendix C C Reference Documents

Seite 9

Type 6 Carrier Board Design GuidePage 96 The following table lists all the reference documents of this design guide. Document Location PICMGR COM Ex

Seite 10 - List of Tables

Type 6 Carrier Board Design Guide Page 97Appendix D D Reference Carrier Board Schematic

Seite 13

Type 6 Carrier Board Design Guide Page 1Chapter 1 1 Introduction

Seite 24 - Page 14

Type 6 Carrier Board Design GuidePage 2 1.1 Introduction This design guide describes the design concept of the COM Express Type 6 module and teaches

Seite 35

Type 6 Carrier Board Design Guide Page 31.2.1 ICE-QM770 Specifications The ICE-QM770 technical specifications are listed below. Specifications/Model

Seite 36 - AC Coupling Cap

Type 6 Carrier Board Design GuidePage 4 Specifications/Model ICE-QM770 I/O Interfaces (Signal to Baseboard) Four USB 3.0 Eight USB 2.0 Two SATA 6Gb

Seite 37 - 3.2 PCI Express

Type 6 Carrier Board Design Guide Page 5The ICE-CV-D25501/N26001 COM Express module provides the main processing chips and is connected to a compati

Seite 38 - 3.2.1 Signal Description

Type 6 Carrier Board Design GuidePage 6 Specifications/Model ICE-CV-D25501/N26001 BIOS UEFI BIOS USB 3.0 ASMedia ASM1042 Embedded Controller iWDD W

Seite 39

Type 6 Carrier Board Design Guide Page 71.4 ICE-DB-T6 Reference Carrier Board The ICE-DB-T6 is a full function carrier board for customers to apply

Seite 40

Type 6 Carrier Board Design GuidePage 8 Specifications/Model ICE-DB-T6 Reference Carrier Board Audio Realtek ALC892 HD Audio codec GPIO 8-bit GPI

Seite 41

Type 6 Carrier Board Design Guide Page 9Specifications/Model ICE-DB-T6 Reference Carrier Board External I/O 1 x VGA 4 x USB 3.0 1 x RJ-45 GbE 2 x

Seite 42

Type 6 Carrier Board Design GuidePage II Revision Date Version Changes 1 August, 2013 1.01 Modified Section 4.5: AT Power Delivery Guideline 15 Ma

Seite 43

Type 6 Carrier Board Design GuidePage 10 Chapter 2 2 Pin Assignments

Seite 44

Type 6 Carrier Board Design Guide Page 112.1 Chapter Overview This chapter describes pin assignments and I/O characteristics for COM Express modules

Seite 45

Type 6 Carrier Board Design GuidePage 12 2.2 COM Express Connector Type The differences among the Module Types are summarized in Table 2-1.  Mod

Seite 46 - 3.4.1 Signal Description

Type 6 Carrier Board Design Guide Page 132.3 Signal Table Terminology The following section describes the signals found on the Type 6 connectors. Ta

Seite 47

Type 6 Carrier Board Design GuidePage 14 2.4 Connector Pinout Row A and Row B Pin Signal I/F I/O Pin Signal I/F I/O A1 GND0 GND - B1

Seite 48

Type 6 Carrier Board Design Guide Page 15Pin Signal I/F I/O Pin Signal I/F I/O A46 USB0+ USB I/O B46 USB1+ USB I/O A47 VCC_RTC

Seite 49

Type 6 Carrier Board Design GuidePage 16 Pin Signal I/F I/O Pin Signal I/F I/O A93 GPO0 GPIO O B93 VGA_HSYNC VGA O A94 SPI_CLK SPI O

Seite 50

Type 6 Carrier Board Design Guide Page 17Pin Signal I/F I/O Pin Signal I/F I/O C26 DDI1_PAIR4- DDI O D26 DDI1_PAIR0+ DDI O C27 RSVD - -

Seite 51 - from Semtech

Type 6 Carrier Board Design GuidePage 18 Pin Signal I/F I/O Pin Signal I/F I/O C74 PEG_RX7+ PEG I D74 PEG_TX7+ PEG O C75 PEG_RX7- P

Seite 52

Type 6 Carrier Board Design Guide Page 19Chapter 3 3 Signal Description and Routing Guideline

Seite 53 - 3.5 DDI

Type 6 Carrier Board Design Guide Page IIICopyright COPYRIGHT NOTICE The information in this document is subject to change without prior notice in o

Seite 54 - Page 44

Type 6 Carrier Board Design GuidePage 20 3.1 PEG (PCI Express Graphic) The PEG Port can utilize COM Express PCIe lanes 16 through 32 to drive a PCIe

Seite 55

Type 6 Carrier Board Design Guide Page 21D81 D82 PEG_TX9+ PEG_TX9- O PEG Port 9. Transmit Output differential pair. C85 C86 PEG_RX10+ PEG_RX10- I

Seite 56

Type 6 Carrier Board Design GuidePage 22 3.1.2 PEG Connector Figure 3-1 illustrates the pinout definition for the standard PCI Express x16 connector

Seite 57 - 3.6 LVDS

Type 6 Carrier Board Design Guide Page 233.1.3 PEG_ENABLE# PEG_ENABLE# is defined on the COM Express connector as a method to configure the COM Ex

Seite 58

Type 6 Carrier Board Design GuidePage 24 Figure 3-2: Intel Recommend Test Structure for PCI Express Data Eye Measurement 3.1.5 PCI Express Routing

Seite 59 - J_VLVDS1

Type 6 Carrier Board Design Guide Page 25Length matching between RX and TX pairs (inter-pair) No strict electrical requirements. Keep difference wi

Seite 60

Type 6 Carrier Board Design GuidePage 26 ICE ModulePEG SLOT or SDVO DeviceTX+TX-RX+RX-AC Coupling Cap Figure 3-3: PEG Lane Connection Topology Examp

Seite 61 - 3.7.1 Signal Description

Type 6 Carrier Board Design Guide Page 27Preferred RoutingAlternative RoutingBad RoutingPreferred RoutingPreferred Routing Figure 3-4: PEG Layout Tr

Seite 62 - 3.8 Reference Circuit

Type 6 Carrier Board Design GuidePage 28 The PCI Express interface of the COM Express module consists of up to six lanes, each with a receive and tr

Seite 63 - 3.9 LAN (Local Area Network)

Type 6 Carrier Board Design Guide Page 293.2.2 PCI Express x1 Slot Table 3-3 illustrates the pinout definition for the standard PCI Express x1 con

Seite 64

Type 6 Carrier Board Design GuidePage IV Table of Contents 1 INTRODUCTION...

Seite 65

Type 6 Carrier Board Design GuidePage 30 L1 COMCHOKE_8_USB1423USB7- 3USB7+ 3+V3.3R71 8.2K_4+V3. 3_DUALTP401R700_4 12PCIE_WAKE_UP#3,6,10,16+V3. 3TP38

Seite 66

Type 6 Carrier Board Design Guide Page 319 GND 10 Reserved** 7 CLKREQ# 8 Reserved** 5 Reserved**** 6 1.5V 3 Reserved**** 4 GND 1 WA

Seite 67

Type 6 Carrier Board Design GuidePage 32 Figure 3-8: Mini Card Top Side Dimensions (Refer to www.pcisig.com) Figure 3-9: Mini Card Connector (Re

Seite 68 - 3.10.2.1 Keyboard/Mouse

Type 6 Carrier Board Design Guide Page 33CLK100M_PCIEx1_SLOT2+5R20 33_412CLK100M_PCIEx1_SLOT2-5R21 33_412CLK100M_PCIEx16_SLOT- 6CLK100M_PCIEx16_SLOT

Seite 69 - 3.11 VGA

Type 6 Carrier Board Design GuidePage 34 A26 SATA2_RX- A22 A23 SATA2_TX+ SATA2_TX- O SATA Serial ATA channel 2 Transmit output differential pa

Seite 70

Type 6 Carrier Board Design Guide Page 35+V3.3ATA_ACT#3,21HDD_LED#11,21R324 470_6_5%+V5D17BAW56LT1_SOT231K13C2K2LED1LEDRED_8_2ACR3224.7KR3234.7KHDD_

Seite 71

Type 6 Carrier Board Design GuidePage 36 3.4 Universal Serial Bus (USB) The Universal Serial Bus (USB) provides a bi-directional, isochronous, hot

Seite 72 - 3.12 Miscellaneous

Type 6 Carrier Board Design Guide Page 37a USB current monitor on the Carrier Board may drive this line low. Do not pull this line high on the Carri

Seite 73

Type 6 Carrier Board Design GuidePage 38 Figure 3-13: Keyed Connector Protocol (Refer to USB2.0 Spec.) The following list explains how the plugs a

Seite 74 - CLEAR CMOS/Super CAP

Type 6 Carrier Board Design Guide Page 39 Pin Signal I/O Description 1 VCC P +5V Power supply 2 DATA- I/O USB Data, negative differential

Seite 75

Type 6 Carrier Board Design Guide Page V3.3 SATA (SERIAL ATA INTERFACE)...

Seite 76 - Power Deliver Design

Type 6 Carrier Board Design GuidePage 40 3.4.4 Over Current Protection Over-current protection for USB ports can be implemented by using power distr

Seite 77 - 4.3 PCB Stackup Example

Type 6 Carrier Board Design Guide Page 41adjacent to the USB Port connector pins. The OC# signal is asserted until the over-current or over-temperat

Seite 78

Type 6 Carrier Board Design GuidePage 42 3.4.6 USB Routing Guideline 3.4.6.1 Impedance Parameters Routing Transfer rate / Port 480 Mbit/s Ma

Seite 79

Type 6 Carrier Board Design Guide Page 43layers with USB 2.0 traces as much as practical. It is preferable to change layers to avoid crossing a plan

Seite 80 - Page 70

Type 6 Carrier Board Design GuidePage 44 C43 DDI3_PAIR1- C46 C47 DDI3_PAIR2+ DDI3_PAIR2- O PCIe DDI 3. Transmit Output differential pair 2. C49 C5

Seite 81

Type 6 Carrier Board Design Guide Page 453.5.2 DDI Pins and Video Interfaces The table below provides the mapping between the DDI pins and the diffe

Seite 82 - 4.4.2 ATX Power Diagram

Type 6 Carrier Board Design GuidePage 46 C38 DDI3_CTRLCLK DP3_AUX+ HDMI3_CTRLCLK D38 DDI3_CTRLDATA DP3_AUX- HDMI3_CTRLDATA C36 DDI3_AUX+

Seite 83 - Chapter

Type 6 Carrier Board Design Guide Page 473.5.2.3 DDI Signal Description: HDMI/DVI Signal I/O Description TMDS[1:3]_DATA[0:2]+ TMDS[1:3]_DATA[0:2]-

Seite 84 - 5.1 Chapter Overview

Type 6 Carrier Board Design GuidePage 48 CMOS A83 LVDS_I2C_CK O 3.3V CMOS DDC I2C clock signal used for flat panel detection and control. A8

Seite 85

Type 6 Carrier Board Design Guide Page 49LVDS_VDD_EN3C2691000P_4_X_50VLVDSC2732.2U_6_Y _10V12C27210U_1210_Y_25V2 15V3.3V(Default)2-31-2J_VLVDS1J_VLV

Seite 86 - 5.3 Connector Footprint

Type 6 Carrier Board Design GuidePage VI 3.9.1 Signal Description ...

Seite 87 - • 1.5mm +0.075/-0.025mm

Type 6 Carrier Board Design GuidePage 50 Figure 3-21: LCD Power Sequence Example (Refer to AUO G150XG01) 3.6.4 LVDS Routing Guideline 3.6.4.1 Impeda

Seite 88 - 5.5 Heat Spread

Type 6 Carrier Board Design Guide Page 51Single-ended Impedance 55 Ohms +/-15% Spacing between pair to pairs (inter-pair) (s) Min. 20mils

Seite 89

Type 6 Carrier Board Design GuidePage 52 Pin Signal I/O Description A30 AC_RST# O 3.3VSB CMOS CODEC Reset. A29 AC_SYNC O 3.3V CMOS

Seite 90 - Page 80

Type 6 Carrier Board Design Guide Page 533.8.1.2 Digital and Analog Signals Isolation Analog audio signals and other digital signals should be route

Seite 91 - 5.6 Design Notes

Type 6 Carrier Board Design GuidePage 54 10Mbit/sec modes. A3 A2 GBE0_MDI3+ GBE0_MDI3- I/O Media Dependent Interface (MDI) differential pair 3.

Seite 92

Type 6 Carrier Board Design Guide Page 553.9.3 LAN Link Activity and Speed LED The COM Express module has four 3.3V open drain outputs to directly d

Seite 93

Type 6 Carrier Board Design GuidePage 56 3.9.4.2 LAN Ground Plane Separation Isolated separation between the analog ground plane and digital ground

Seite 94 - A Terminology

Type 6 Carrier Board Design Guide Page 57 Pin Signal I/O Description A50 LPC_SERIRQ I/O 3.3V CMOS LPC serialized IRQ. B3 LPC_FRAME# O

Seite 95

Type 6 Carrier Board Design GuidePage 58 Figure 3-24: Windbond W83627DHG Reference Design 3.10.2.1 Keyboard/Mouse The following figures display refe

Seite 96 - Page 86

Type 6 Carrier Board Design Guide Page 59U16KBMF01SC6DI1GND2CLKI3CLKO4DO6VCC5U15KBMF01SC6DI1GND2CLKI3CLKO4DO6VCC5+V5_DUAL+V5_DUALMS_C LK#13MS_D AT#1

Seite 97 - B Application Notes

Type 6 Carrier Board Design Guide Page VII4.4.2 ATX Power Diagram...

Seite 98 - B.2 Updating BIOS Version

Type 6 Carrier Board Design GuidePage 60 3.11.1 Signal Description Table 3-20 shows COM Express VGA signals, including pin number, signals, I/O, pow

Seite 99

Type 6 Carrier Board Design Guide Page 613.11.4 Routing Guide Line 3.11.4.1 HSYNC and VSYNC Signals The horizontal and vertical sync signals &apos

Seite 100 - Page 90

Type 6 Carrier Board Design GuidePage 62 R161 0_41 2R160 33_41 2VGA_HSYN CVGA_VSY N CVGA_BLUVGA_GRNVGA_RED+V5 +V3.3VGA_I2C_CKR156 @2.2K_41 [email protected]

Seite 101

Type 6 Carrier Board Design Guide Page 63"PS_ON" and can be used to control an ATX power supply.B66 WAKE0# I CMOS PCI Express wake up s

Seite 102 - B.2.2 Using DOS Command

Type 6 Carrier Board Design GuidePage 64 3.12.2 Speaker/FAN Control/RTC Reference 3.12.2.1 Speaker Out BuzzerR325 2.7K_41 2Q142N3904_SOT23ECBR32133_

Seite 103

Type 6 Carrier Board Design Guide Page 653.12.2.3 Fan Control Figure 3-31: Fan Reference Schematic

Seite 104 - B.3 RTC Overview

Type 6 Carrier Board Design GuidePage 66 Chapter 4 4 PCB Stack and Power Deliver Design

Seite 105 - C Reference Documents

Type 6 Carrier Board Design Guide Page 674.1 Chapter Overview A brief description of the Printed Circuit Board (PCB) for COM Express based board is

Seite 106 - Page 96

Type 6 Carrier Board Design GuidePage 68 4.3.1 Four-Layer Stack-up Figure 4-1 below is an example of a four layer stack-up. Layers L1 and L4 are us

Seite 107 - Board Schematic

Type 6 Carrier Board Design Guide Page 69and 5 respectively. Inner Layer 3 and Layer 4 are asymmetric striplines that are referenced to planes on La

Seite 108

Type 6 Carrier Board Design GuidePage VIII List of Figures Figure 1-1: ICE-QM770 ...

Seite 109

Type 6 Carrier Board Design GuidePage 70 strip-line layers.  For high-speed signals transitioning between layers next to the component, the signal

Seite 110

Type 6 Carrier Board Design Guide Page 714.4.1 ATX Power States (S0, S3, S4, S5, G3) The ATX power source will provide 12V, -12V, 5V, -5V, 3.3V and

Seite 111

Type 6 Carrier Board Design GuidePage 72 4.4.2 ATX Power Diagram ATX PowerSourceCOM-ExpressModuleLDO+3.3VSB+12V+5VSBBattery(3.3V)+5V+3.3V-12V-5V Fig

Seite 112

Type 6 Carrier Board Design Guide Page 73 Chapter 5 5 Mechanical Design Guidelines

Seite 113

Type 6 Carrier Board Design GuidePage 74 5.1 Chapter Overview The interconnection between COM Express modules and the carrier board uses two 220-pin

Seite 114

Type 6 Carrier Board Design Guide Page 75 Figure 5-1: Module Connector Picture 5.2.2 Carrier Board Connector The single 220-pin 0.5mm pitch carrier

Seite 115

Type 6 Carrier Board Design GuidePage 76 5.3 Connector Footprint It is essential that the distance and the alignment of the dual connector shape on

Seite 116

Type 6 Carrier Board Design Guide Page 77The COM Express PnP Initiative strongly recommends to use the following location peg hole tolerances instea

Seite 117

Type 6 Carrier Board Design GuidePage 78 Figure 5-5: Compact, Basic and Extended Form Factor 5.5 Heat Spread One of the important factors for the sy

Seite 118

Type 6 Carrier Board Design Guide Page 79Figure 5-6: Overall Height for Heatspreader in Basic and Extended Modules All dimensions in mm. Tolerances

Seite 119

Type 6 Carrier Board Design Guide Page IXFigure 3-27: VGA Connector D-SUB15...

Seite 120

Type 6 Carrier Board Design GuidePage 80 Figure 5-8: Basic Module Heatspreader Footprint All dimensions are in mm. X-Y tolerances shall be ± 0.3mm

Seite 121

Type 6 Carrier Board Design Guide Page 81 Figure 5-9: IEI Heat Spread Module 5.6 Design Notes 5.6.1 Component Height — Module Back and Carrier Board

Seite 122

Type 6 Carrier Board Design GuidePage 82 Figure 5-10: Component Clearances Underneath Module 5.6.2 Air Follow Issue The air flow of the IEI COM Exp

Seite 123

Type 6 Carrier Board Design Guide Page 83chassis ground through the heat sink andor heatspreader. System designers should take this into account whe

Seite 124

Type 6 Carrier Board Design GuidePage 84 Appendix A A Terminology

Seite 125

Type 6 Carrier Board Design Guide Page 85 Terminology Description AC97 Audio Codec 97 (AC’97) refers to a codec standard developed by Intel® in 1997

Seite 126

Type 6 Carrier Board Design GuidePage 86 PAL Phase Alternate Line PCI Peripheral Component Interface RTC Real Time Clock SMBus System Management Bus

Seite 127

Type 6 Carrier Board Design Guide Page 87Appendix B B Application Notes

Seite 128

Type 6 Carrier Board Design GuidePage 88 NOTE: IEI is able to provide customers with the ICE module design guide and information as well as many o

Seite 129

Type 6 Carrier Board Design Guide Page 89 Figure B-1: BIOS Main Menu (BIOS Version: MR10) B.2.1 Using AFUWIN To use AFUWIN application to update th

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