Iei-integration ICE-DB-9S Bedienungsanleitung PDF herunterladen (Seite 117)

ICE Module

Page 104

Carrier Board topside components within the module envelope shall be limited to a

height of 4 mm (dimension ‘C’ in Figure 6-11), with the exception of the mating

connectors. Using Carrier Board topside components up to 4mm allows a gap of 0.2

mm between Carrier Board topside components and module bottom side components.

This may not be sufficient in some situations. In Carrier Board applications in which

vibration or board flex is a concern, then the Carrier Board component height should

be restricted to a value less than 4 mm that yields a clearance that is sufficient for the

application.

Figure 6-10: Component Clearances Underneath Module

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Iei-integration ICE-DB-9S Bedienungsanleitung Seite 117